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Low cost BOM
- Single chip
- Low external component count
- Phone clock re-use (13 or 26 MHz crystal)
Low cost chip
- RF grade, advanced CMOS process
Low cost integration in a terminal
- USB and SDIO interfaces to the host processor
- Complete reference design board
- Software drivers
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Why is it important?
- Isolation is really a key issue, not only to prevent the DSP from interfering with the RF section, but also to avoid LO leakage and high DC offsets. Simulation tools can help, together with extensive experience.
- A direct conversion architecture saves a lot of costly external passive components, and the challenge is to get it right first time.
- You really need a fully characterized and qualified RF process, otherwise manufacturing yield could be jeopardized, and there is a risk of redesign. Our foundry partner provides a superior quality design kit, and Abilis has been selected as one of their very first customers for this new RF CMOS process.
- Our application engineers have put a lot of effort into providing a “plug-and-play” solution. With their support, you can achieve very short leadtimes to high volume production.
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